CCP offers the full range of testing solutions, from fine pitch 0.07mm IC probes, Burn-In, WLSCP, Final Tests to ICT Testing solutions. Our solutions are used by industry leaders such as TSMC, Foxconn, Intel, SPIL and Skyworks.
We offer spring probes for pitches of less than 0.12mm.
IC Test Socket Pitches
We manufacture all major types of testing sockets.
Quad Flat Package
Quad Flat No-leads package
Ball grid array Package
Package on package
Wafer Level Chip-Scale Package
Test Up to 77 GHz
Increasing bandwidth requires higher and higher frequencies. With the advent of 5G frequencies of more than 40GHz need robust and reliable testing solutions.
The Mirror Process
During the testing procedure probe tips slowly accumulate solder-dust on their tips resulting in a loss of conductivity. CCP's patented Mirror Process Technology improves the surface of the probe head by burnishing it until dust can no longer stick to it. As a result the smooth surface matches that of a mirror.
Less Cleaning, less Machine Downtime
50% Improved Durability
Better Signal Transmission
We Innovate, We Care
Our production process is fully owned by us. All probes and sockets are designed and manufactured by CCP and go through a rigorous quality check to ensure that we meet the high quality standards you expect.
More than 10% of our annual revenue is invested into R&D, to ensure that our products are always at the forefront of the technological development.
Our engineering team consists of industry veterans with more than 30 years of experience in the testing industry. In order to find the right solution for you we are always willing to go the extra mile required.
Testing Solutions From A-Z
Introduction Testing Solutions
Every Solution You Are Looking For
Get in touch with our experts and gain access to over 10,000 different connectors and custom solutions now!